M370 – SVP

Signal chain

  • Phase sensitive detection using microprocessor
  • controlled lock-in amplifier with digital dual phase
  • oscillator and differential electrometer input.

Lock-in amplifier

  • Software controllable gain range. Gain 1-105.
  • Maximum theoretical sensitivity 50 nA FSD.
  • Output time constant 0.1, 1, 10 s.

Differential electrometer

  • 1015 Ohms input impedance. Decade gain ranges
  • 0 to 80dB.
  • Common mode range ±12 V.

Vibration actuator

  • One dimensional low voltage piezo-electric actuator.

Vibration amplitude (±10%)

  • Software set from 0 – 30 µm perpendicular to sample surface.

Probe type

  • Standard SRET™ MkIII platinized platinum probe socket.

Electrochemical sensitivity

  • Better than 5 µA/cm² (using standard PIS test approach).


Positioning system specifications

Stepper Motors

  • Scan range (x, y, z) mm: 70 mm x 70 mm x 70 mm.
  • Minimal step size on all axes: 1 µm
  • Closed loop positioning linear zero hysteresis encoder with direct real-time readout of displacement in x, y and z
  • Linear position encoder resolution: 100 nm.
  • Maximum scan speed: 2 mm/s.
  • Measurement resolution: 16 Bit @100kHz.
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    Used to map and quantify local electrochemical and corrosion events in real time.

    The Scanning Vibrating Electrode Technique (SVET) operates with a non-intrusive scanning, vibrating probe measuring and mapping the electric field generated in a plane above the surface of an electrochemically active sample.

    This enables the user to map and quantify local electrochemical and corrosion events in real time. The SVP370 vibrating probe system provides increased electrical sensitivity as well as enhanced system stability. Localised corrosion events of less than 5µA/cm² can be measured with this extremely sensitive technique.

    The probe vibration is controlled by a piezoceramic displacement device allowing vibration amplitudes from 1-30 µm (perpendicular to the sample surface).
    It is an ac technique, thus, high system sensitivity is achieved via a differential electrometer in conjunction with an integrated lock-in amplifier.

    The topology of the sample can be measured by Optical Surface Profiling technique (OSP370) and is recognized by the M370 software.

    Any of the experiments that can use Height-Tracking (SVP, SKP, SECM, SDS, LEIS) can use this information to move the probe relative to the topography of the sample.

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